ks8028全自动金线焊线机

THE 8028 INCREASES YOUR
PROCESS CAPABILITY AND
PROVIDES SUPERIOR SPEEDS.
Process Capability
• 43 micron bonded ball (for 60 micron
pitch) production process.
• Leading edge low temperature
BGA process technology.
• Extensive range of material
handling capabilities.
• Optional dual magnification optics sur-
passes all ultra-fine pitch requirements
while maintaining high throughput.
Superior Speeds
• Fastest wire bonder in the world.
• Fully programmable Material
Handling System.
• State of the art vision system delivers
improved reliability and reduced teach
times for today’s advanced devices.
Improved XY Table
• Larger bondable area for wider matrix
applications and advanced designs.
• Lightweight XY table design delivers
ultra high speed while maintaining
0.1µm resolution.
WIRE BonDING CAPABILITY
Fine Pitch
60µm in-line @ 3 sigma production
process
Total Bond Placement Repeatability
+/-5.0µm @ 3 sigma
Bonding Area
50mm X by 65mm Y
(2.0 in X by 2.56 in Y)
User selecable Processes:
Standard
Standard Loop
Standard Worked Loop
BGA2 Loop
BGA2 Worked Loop
Premium Options
BGA3 Low Loop
BGA4 CD Loop
J-Wire Loop
Spider Loop
Security Bond
CSP Loop
LOOPING CAPABILITY
(with 25.4 µm wire diameter)
Maximum Wire Length:
7.6mm (0.300 in)
Minimum Loop Height:
100µm (0.004 in)
Wire Sway:
wire length < 2.54mm (0.100 in):
+/- 1 wire diameter @ 3 sigma
wire length > 2.54mm (0.100 in):
+/- 1% wire length @ 3 sigma
MATERIAL CAPABILITY
Package/Leadframe Dimensions
Length:
90 to 267mm (3.5 to 10.5 in)
Width:
15.2 to 81mm (0.6 to 3.2 in)
Thickness:
0.10 to 0.89mm (0.004 to 0.035 in)
Die Pad Down-set:
Up to 2.3mm (90 mils)
Magazines
Width:
20mm to 95mm (0.8 to 3.75 in)
Length:
127mm to 273mm (5.00 to 10.75 in)
Height:
50mm to 178mm (2.0 to 7.0 in)
Slot Pitch:
1.27mm to 25mm (0.05 to 1.0 in)
MATERIAL HANDLING SYSTEMS
(MHS) CONFIGURATIONS
• Flat Boat
• Tape BGA
• Factory System Interfaces with
Back Load MHS and Top Load MHS**
• Bar Code Readers**
ConVERSION TIMES
Within Same Leadframe Type:
< 4 minutes
(Heat block insert & clamp change,
program load from disk).
Between Different Leadframe Types:
< 5 minutes
(Leadframe width & length changes,
magazine size change, heat block insert &
clamp change, program load from disk).