39-ICH08_ASEC胶水衡鹏供应

39-ICH08_ASEC胶水 衡鹏供应
ASEC 39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.

39-ICH08_ASEC胶水特长：
Liquid state
Property    Typical Value   Test Condition
Chemical    Epoxy (Black)
Specific Grity 1.4                @25度
Thixotropic ind 1.0             12s-1/120s-1
Viscosity    4.200 mPa·s        Cone plate type, 120s-1

Cured state
Property      Typical Value   Test Condition
Tensile Modulus         4.6 Gpa               25度, DMA
Tg                 120度                 DMS
CTE α1/α2         39/105  ppm/度         TMA
Tensile shear strength 16 Mpa               JIS K 6850
Volume resistivity 2.28 x 1015Ω·cm     JIS K 6911
Surface resistivity 9.7 x 1015Ω       JIS K 6911
Dielectric constant 3.08               1.0GHz
                3.05               2.45GHz
Dielectric loss tangent 0.015               1.0GHz
                0.015               2.45GHz


39-ICH08_ASEC胶水相关产品：
衡鹏供应
ASEC胶水39-ICH09